MPC555LFAVR40 vs MPC562CZP56 feature comparison

MPC555LFAVR40 onsemi

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MPC562CZP56 Motorola Semiconductor Products

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer ONSEMI MOTOROLA INC
Part Package Code BGA
Package Description 27 X 27 MM, 2.35 MM HEIGHT, 1.27 MM PITCH, ROHS COMPLIANT, PLASTIC, BGA-272 BGA, BGA388,26X26,40
Pin Count 272
Reach Compliance Code unknown unknown
ECCN Code 3A001.A.2.C
HTS Code 8542.31.00.01 8542.31.00.01
Has ADC YES YES
Additional Feature ALSO REQUIRES 5V SUPPLY
Address Bus Width 24 24
Bit Size 32 32
Boundary Scan YES
CPU Family MPC500
Clock Frequency-Max 20 MHz 20 MHz
DAC Channels NO NO
DMA Channels NO NO
External Data Bus Width 32 32
Format FLOATING POINT
JESD-30 Code S-PBGA-B272 S-PBGA-B388
Length 27 mm 27 mm
Low Power Mode YES
Number of DMA Channels
Number of I/O Lines 101 16
Number of Serial I/Os 4
Number of Terminals 272 388
Number of Timers 3
On Chip Data RAM Width 8
On Chip Program ROM Width 8
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -55 °C -40 °C
PWM Channels YES YES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Equivalence Code BGA272,20X20,50 BGA388,26X26,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Qualification Status Not Qualified Not Qualified
RAM (bytes) 26624 32768
ROM (words) 458752
ROM Programmability FLASH FLASH
Seated Height-Max 2.65 mm 2.55 mm
Speed 40 MHz 56 MHz
Supply Voltage-Max 3.6 V 2.7 V
Supply Voltage-Min 3 V 2.5 V
Supply Voltage-Nom 3.3 V 2.6 V
Surface Mount YES YES
Technology HCMOS CMOS
Temperature Grade MILITARY INDUSTRIAL
Terminal Form BALL BALL
Terminal Pitch 1.27 mm 1 mm
Terminal Position BOTTOM BOTTOM
Width 27 mm 27 mm
uPs/uCs/Peripheral ICs Type MICROCONTROLLER, RISC MICROCONTROLLER, RISC
Base Number Matches 3 3

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Compare MPC562CZP56 with alternatives