MPC5554AVR132R2
vs
MPC5554MZP132R2
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Active
Not Recommended
Ihs Manufacturer
NXP SEMICONDUCTORS
NXP SEMICONDUCTORS
Package Description
27 X 27 MM, 1 MM PITCH, LEAD FREE, PLASTIC, MS-034AAL-1, TEPBGA-416
27 X 27 MM, 1 MM PITCH, PLASTIC, MS-034AAL-1, TEBGA-416
Reach Compliance Code
compliant
not_compliant
ECCN Code
3A001.A.2.C
3A991.A.2
HTS Code
8542.31.00.01
8542.31.00.01
Has ADC
YES
YES
Additional Feature
IT ALSO REQUIRES 3.3V SUPPLY
IT ALSO REQUIRES 3.3V SUPPLY
Address Bus Width
24
24
Bit Size
32
32
Clock Frequency-Max
20 MHz
20 MHz
DAC Channels
NO
NO
DMA Channels
NO
NO
External Data Bus Width
32
32
JESD-30 Code
S-PBGA-B416
S-PBGA-B416
Length
27 mm
27 mm
Number of Terminals
416
416
On Chip Program ROM Width
8
8
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-40 °C
PWM Channels
YES
YES
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
HBGA
HBGA
Package Equivalence Code
BGA416,26X26,40
BGA416,26X26,40
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY, HEAT SINK/SLUG
GRID ARRAY, HEAT SINK/SLUG
Qualification Status
Not Qualified
Not Qualified
RAM (bytes)
65536
65536
ROM (words)
2097152
2097152
ROM Programmability
FLASH
FLASH
Seated Height-Max
2.55 mm
2.55 mm
Speed
132 MHz
132 MHz
Supply Voltage-Max
1.65 V
1.65 V
Supply Voltage-Min
1.35 V
1.35 V
Supply Voltage-Nom
1.5 V
1.5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
MILITARY
AUTOMOTIVE
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Width
27 mm
27 mm
uPs/uCs/Peripheral ICs Type
MICROCONTROLLER
MICROCONTROLLER
Base Number Matches
1
1
Factory Lead Time
12 Weeks
Samacsys Manufacturer
NXP
JESD-609 Code
e0
Moisture Sensitivity Level
3
Peak Reflow Temperature (Cel)
245
Supply Current-Max
600 mA
Terminal Finish
Tin/Lead/Silver (Sn/Pb/Ag)
Time@Peak Reflow Temperature-Max (s)
30
Compare MPC5554AVR132R2 with alternatives
Compare MPC5554MZP132R2 with alternatives