MPC5200CVR266B vs SPC5200CBV400B feature comparison

MPC5200CVR266B Freescale Semiconductor

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SPC5200CBV400B NXP Semiconductors

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Rohs Code Yes No
Part Life Cycle Code Obsolete Not Recommended
Ihs Manufacturer FREESCALE SEMICONDUCTOR INC NXP SEMICONDUCTORS
Part Package Code BGA
Package Description BGA, BGA272,20X20,50 27 X 27 MM, 1.27 MM PITCH, PLASTIC, BGA-272
Pin Count 272
Reach Compliance Code unknown not_compliant
ECCN Code 3A991.A.2 3A991.A.2
HTS Code 8542.31.00.01 8542.31.00.01
Additional Feature ALSO REQUIRES 3.3V SUPPLY ALSO REQUIRES 3.3V SUPPLY
Address Bus Width 32 32
Bit Size 32 32
Boundary Scan YES YES
Clock Frequency-Max 35 MHz 66 MHz
External Data Bus Width 32 32
Format FIXED POINT FLOATING POINT
Integrated Cache YES YES
JESD-30 Code S-PBGA-B272 S-PBGA-B272
Length 27 mm 27 mm
Low Power Mode YES YES
Number of Terminals 272 272
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Equivalence Code BGA272,20X20,50 BGA272,20X20,50
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Peak Reflow Temperature (Cel) NOT SPECIFIED 245
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.65 mm 2.65 mm
Speed 266 MHz 400 MHz
Supply Voltage-Max 1.58 V 1.58 V
Supply Voltage-Min 1.42 V 1.42 V
Supply Voltage-Nom 1.5 V 1.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Form BALL BALL
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED 30
Width 27 mm 27 mm
uPs/uCs/Peripheral ICs Type MICROPROCESSOR MICROPROCESSOR
Base Number Matches 1 2
Factory Lead Time 16 Weeks
Samacsys Manufacturer NXP
JESD-609 Code e0
Moisture Sensitivity Level 3
Screening Level AEC-Q100
Terminal Finish Tin/Lead/Silver (Sn/Pb/Ag)

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