MPC5200CBV266B
vs
IDT79RV5000250BS
feature comparison
Pbfree Code |
No
|
No
|
Rohs Code |
No
|
No
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
FREESCALE SEMICONDUCTOR INC
|
INTEGRATED DEVICE TECHNOLOGY INC
|
Part Package Code |
BGA
|
BGA
|
Package Description |
BGA, BGA272,20X20,50
|
LBGA, BGA272,21X21,50
|
Pin Count |
272
|
272
|
Reach Compliance Code |
unknown
|
not_compliant
|
ECCN Code |
3A991.A.2
|
3A991.A.2
|
HTS Code |
8542.31.00.01
|
8542.31.00.01
|
Additional Feature |
ALSO REQUIRES 3.3V SUPPLY
|
|
Address Bus Width |
32
|
64
|
Bit Size |
32
|
64
|
Boundary Scan |
YES
|
YES
|
Clock Frequency-Max |
35 MHz
|
250 MHz
|
External Data Bus Width |
32
|
64
|
Format |
FIXED POINT
|
FLOATING POINT
|
Integrated Cache |
YES
|
NO
|
JESD-30 Code |
S-PBGA-B272
|
S-PBGA-B272
|
JESD-609 Code |
e0
|
e0
|
Length |
27 mm
|
29 mm
|
Low Power Mode |
YES
|
YES
|
Number of Terminals |
272
|
272
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
BGA
|
LBGA
|
Package Equivalence Code |
BGA272,20X20,50
|
BGA272,21X21,50
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
GRID ARRAY
|
GRID ARRAY, LOW PROFILE
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
2.65 mm
|
1.65 mm
|
Speed |
266 MHz
|
250 MHz
|
Supply Voltage-Max |
1.58 V
|
3.465 V
|
Supply Voltage-Min |
1.42 V
|
3.135 V
|
Supply Voltage-Nom |
1.5 V
|
3.3 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
INDUSTRIAL
|
OTHER
|
Terminal Finish |
TIN LEAD
|
TIN LEAD
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
1.27 mm
|
1.27 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Width |
27 mm
|
29 mm
|
uPs/uCs/Peripheral ICs Type |
MICROPROCESSOR
|
MICROPROCESSOR, RISC
|
Base Number Matches |
1
|
1
|
Supply Current-Max |
|
1800 mA
|
|
|
|
Compare MPC5200CBV266B with alternatives
Compare IDT79RV5000250BS with alternatives