MPC5200BV400 vs SPC5200CBV400B feature comparison

MPC5200BV400 Motorola Mobility LLC

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SPC5200CBV400B NXP Semiconductors

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Part Life Cycle Code Transferred Not Recommended
Ihs Manufacturer MOTOROLA INC NXP SEMICONDUCTORS
Part Package Code BGA
Package Description BGA, BGA272,20X20,50 27 X 27 MM, 1.27 MM PITCH, PLASTIC, BGA-272
Pin Count 272
Reach Compliance Code unknown not_compliant
ECCN Code 3A991.A.2 3A991.A.2
HTS Code 8542.31.00.01 8542.31.00.01
Address Bus Width 32 32
Bit Size 32 32
Boundary Scan YES YES
Clock Frequency-Max 35 MHz 66 MHz
External Data Bus Width 32 32
Format FIXED POINT FLOATING POINT
Integrated Cache YES YES
JESD-30 Code S-PBGA-B272 S-PBGA-B272
Length 27 mm 27 mm
Low Power Mode YES YES
Number of Terminals 272 272
Operating Temperature-Max 70 °C 85 °C
Operating Temperature-Min -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Equivalence Code BGA272,20X20,50 BGA272,20X20,50
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.65 mm 2.65 mm
Speed 400 MHz 400 MHz
Supply Voltage-Max 1.58 V 1.58 V
Supply Voltage-Min 1.42 V 1.42 V
Supply Voltage-Nom 1.5 V 1.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL INDUSTRIAL
Terminal Form BALL BALL
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position BOTTOM BOTTOM
Width 27 mm 27 mm
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC MICROPROCESSOR
Base Number Matches 4 2
Rohs Code No
Factory Lead Time 16 Weeks
Samacsys Manufacturer NXP
Additional Feature ALSO REQUIRES 3.3V SUPPLY
JESD-609 Code e0
Moisture Sensitivity Level 3
Peak Reflow Temperature (Cel) 245
Screening Level AEC-Q100
Terminal Finish Tin/Lead/Silver (Sn/Pb/Ag)
Time@Peak Reflow Temperature-Max (s) 30

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