MPC509
vs
MPC564MZP56
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
MOTOROLA INC
FREESCALE SEMICONDUCTOR INC
Package Description
QFP,
27 X 27 MM, 1 MM PITCH, PLASTIC, MO-151, BGA-388
Reach Compliance Code
unknown
not_compliant
HTS Code
8542.31.00.01
8542.31.00.01
Has ADC
NO
NO
Address Bus Width
30
24
Bit Size
32
32
DAC Channels
NO
NO
DMA Channels
NO
NO
External Data Bus Width
32
32
JESD-30 Code
S-PQFP-G16
S-PBGA-B388
Length
28 mm
27 mm
Number of I/O Lines
58
16
Number of Terminals
16
388
PWM Channels
NO
NO
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
QFP
BGA
Package Shape
SQUARE
SQUARE
Package Style
FLATPACK
GRID ARRAY
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
3.85 mm
2.55 mm
Supply Voltage-Nom
3.3 V
2.6 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Terminal Form
GULL WING
BALL
Terminal Pitch
0.65 mm
1 mm
Terminal Position
QUAD
BOTTOM
Width
28 mm
27 mm
uPs/uCs/Peripheral ICs Type
MICROCONTROLLER, RISC
MICROCONTROLLER, RISC
Base Number Matches
1
2
Pbfree Code
Rohs Code
Part Package Code
BGA
Pin Count
388
ECCN Code
3A991.A.2
Clock Frequency-Max
20 MHz
JESD-609 Code
e0
Moisture Sensitivity Level
3
On Chip Program ROM Width
8
Operating Temperature-Max
125 °C
Operating Temperature-Min
-40 °C
Package Equivalence Code
BGA388,26X26,40
Peak Reflow Temperature (Cel)
240
RAM (bytes)
32768
ROM (words)
524288
ROM Programmability
FLASH
Speed
56 MHz
Supply Voltage-Max
2.7 V
Supply Voltage-Min
2.5 V
Temperature Grade
AUTOMOTIVE
Terminal Finish
Tin/Lead/Silver (Sn62Pb36Ag2)
Time@Peak Reflow Temperature-Max (s)
30
Compare MPC509 with alternatives
Compare MPC564MZP56 with alternatives