MPC106ARX66TG
vs
TSI106G-66KB
feature comparison
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
MOTOROLA INC
|
TUNDRA SEMICONDUCTOR CORP
|
| Package Description |
BGA,
|
21 X 25 MM, 3.16 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-304
|
| Reach Compliance Code |
unknown
|
unknown
|
| ECCN Code |
3A991.A.2
|
|
| HTS Code |
8542.31.00.01
|
|
| Address Bus Width |
32
|
32
|
| Bus Compatibility |
60X; POWERPC 601; POWERPC 603; POWERPC 604
|
60X; POWERPC 601; POWERPC 603; POWERPC 604
|
| Clock Frequency-Max |
66 MHz
|
33.33 MHz
|
| External Data Bus Width |
64
|
64
|
| JESD-30 Code |
R-CBGA-B304
|
R-CBGA-B304
|
| Length |
25 mm
|
25 mm
|
| Moisture Sensitivity Level |
1
|
1
|
| Number of Terminals |
304
|
304
|
| Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
CERAMIC, METAL-SEALED COFIRED
|
| Package Code |
BGA
|
BGA
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
GRID ARRAY
|
GRID ARRAY
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
3.16 mm
|
3.16 mm
|
| Supply Voltage-Max |
3.465 V
|
3.465 V
|
| Supply Voltage-Min |
3.135 V
|
3.135 V
|
| Supply Voltage-Nom |
3.3 V
|
3.3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Pitch |
1.27 mm
|
1.27 mm
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Width |
21 mm
|
21 mm
|
| uPs/uCs/Peripheral ICs Type |
BUS CONTROLLER, PCI
|
BUS CONTROLLER, PCI
|
| Base Number Matches |
1
|
1
|
| Operating Temperature-Max |
|
105 °C
|
| Operating Temperature-Min |
|
|
|
|
|
Compare MPC106ARX66TG with alternatives
Compare TSI106G-66KB with alternatives