MPA1765PC
vs
XC1765D-DD8M
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
MOTOROLA INC
XILINX INC
Package Description
DIP,
CERAMIC, DIP-8
Reach Compliance Code
unknown
unknown
ECCN Code
EAR99
3A001.A.2.C
HTS Code
8542.32.00.71
8542.32.00.51
kg CO2e/kg
12
12
Average Weight (mg)
569.675
569.675
CO2e (mg)
6836.1
6836.1
Category CO2 Kg
12
12
Compliance Temperature Grade
Commercial: +0C to +70C
Military: -55C to +125C
JESD-30 Code
R-PDIP-T8
R-GDIP-T8
Length
9.78 mm
9.906 mm
Memory Density
65536 bit
65536 bit
Memory IC Type
OTP ROM
CONFIGURATION MEMORY
Memory Width
1
1
Number of Functions
1
1
Number of Terminals
8
8
Number of Words
65536 words
65536 words
Number of Words Code
64000
64000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
70 °C
125 °C
Operating Temperature-Min
-55 °C
Organization
64KX1
64KX1
Output Characteristics
3-STATE
3-STATE
Package Body Material
PLASTIC/EPOXY
CERAMIC, GLASS-SEALED
Package Code
DIP
DIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Parallel/Serial
SERIAL
SERIAL
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
4.45 mm
4.318 mm
Supply Voltage-Max (Vsup)
6 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
MILITARY
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Width
7.62 mm
7.62 mm
Base Number Matches
2
1
Pbfree Code
Rohs Code
Part Package Code
DIP
Pin Count
8
Additional Feature
USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS
Clock Frequency-Max (fCLK)
5 MHz
I/O Type
COMMON
JESD-609 Code
e0
Package Equivalence Code
DIP8,.3
Standby Current-Max
0.0015 A
Supply Current-Max
0.01 mA
Terminal Finish
TIN LEAD
Compare MPA1765PC with alternatives
Compare XC1765D-DD8M with alternatives