MPA17128DI vs XC17256LVO8C feature comparison

MPA17128DI Motorola Mobility LLC

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XC17256LVO8C AMD Xilinx

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer MOTOROLA INC XILINX INC
Part Package Code SOIC TSOP
Package Description SOP, PLASTIC, TSOP-8
Pin Count 8 8
Reach Compliance Code unknown not_compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.71 8542.32.00.51
JESD-30 Code R-PDSO-G8 R-PDSO-G8
Length 4.9 mm 4.9276 mm
Memory Density 131072 bit 262144 bit
Memory IC Type OTP ROM CONFIGURATION MEMORY
Memory Width 1 1
Number of Functions 1 1
Number of Terminals 8 8
Number of Words 131072 words 262144 words
Number of Words Code 128000 256000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 85 °C 70 °C
Operating Temperature-Min -40 °C
Organization 128KX1 256KX1
Output Characteristics 3-STATE 3-STATE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP TSOP2
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE, THIN PROFILE
Parallel/Serial SERIAL SERIAL
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.75 mm 1.1938 mm
Supply Voltage-Max (Vsup) 6 V 5.25 V
Supply Voltage-Min (Vsup) 4.5 V 4.75 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL COMMERCIAL
Terminal Form GULL WING GULL WING
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position DUAL DUAL
Width 3.9 mm 3.937 mm
Base Number Matches 2 1
Rohs Code No
Clock Frequency-Max (fCLK) 10 MHz
I/O Type COMMON
JESD-609 Code e0
Moisture Sensitivity Level 3
Package Equivalence Code TSOP8,.25
Peak Reflow Temperature (Cel) 225
Standby Current-Max 0.00005 A
Supply Current-Max 0.005 mA
Terminal Finish TIN LEAD
Time@Peak Reflow Temperature-Max (s) 30

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