MP3274AG
vs
MP3274SG/883
feature comparison
| Rohs Code |
No
|
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
EXAR CORP
|
MICRO POWER SYSTEMS
|
| Part Package Code |
PGA
|
|
| Package Description |
PGA, PGA68,11X11
|
,
|
| Pin Count |
68
|
|
| Reach Compliance Code |
unknown
|
unknown
|
| HTS Code |
8542.39.00.01
|
|
| Analog Input Voltage-Max |
10 V
|
10 V
|
| Analog Input Voltage-Min |
-10 V
|
-10 V
|
| Conversion Time-Max |
15 µs
|
15 µs
|
| Converter Type |
ADC, SUCCESSIVE APPROXIMATION
|
ADC, SUCCESSIVE APPROXIMATION
|
| JESD-30 Code |
S-CPGA-P68
|
S-XPGA-P68
|
| JESD-609 Code |
e0
|
|
| Length |
27.9 mm
|
|
| Linearity Error-Max (EL) |
0.0488%
|
0.048%
|
| Negative Supply Voltage-Nom |
-15 V
|
-15 V
|
| Number of Analog In Channels |
32
|
|
| Number of Bits |
12
|
12
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
68
|
68
|
| Operating Temperature-Max |
85 °C
|
125 °C
|
| Operating Temperature-Min |
-40 °C
|
-55 °C
|
| Output Bit Code |
2'S COMPLEMENT BINARY
|
2'S COMPLEMENT BINARY
|
| Output Format |
SERIAL, PARALLEL, WORD
|
PARALLEL, WORD, SERIAL
|
| Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
UNSPECIFIED
|
| Package Code |
PGA
|
|
| Package Equivalence Code |
PGA68,11X11
|
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
GRID ARRAY
|
GRID ARRAY
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Sample and Hold / Track and Hold |
SAMPLE
|
SAMPLE
|
| Seated Height-Max |
3.68 mm
|
|
| Supply Current-Max |
8 mA
|
8 mA
|
| Supply Voltage-Nom |
15 V
|
15 V
|
| Surface Mount |
NO
|
NO
|
| Technology |
BICMOS
|
BICMOS
|
| Temperature Grade |
INDUSTRIAL
|
MILITARY
|
| Terminal Finish |
TIN LEAD
|
|
| Terminal Form |
PIN/PEG
|
PIN/PEG
|
| Terminal Pitch |
2.54 mm
|
|
| Terminal Position |
PERPENDICULAR
|
PERPENDICULAR
|
| Width |
27.9 mm
|
|
| Base Number Matches |
1
|
1
|
|
|
|