MNR18E0APJ750 vs EXB2HV750JV feature comparison

MNR18E0APJ750 ROHM Semiconductor

Buy Now Datasheet

EXB2HV750JV Panasonic Electronic Components

Buy Now Datasheet
Pbfree Code Yes Yes
Rohs Code Yes Yes
Part Life Cycle Code Obsolete Active
Ihs Manufacturer ROHM CO LTD PANASONIC CORP
Package Description CHIP CHIP
Reach Compliance Code compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8533.21.00.20 8533.21.00.20
Construction Rectangular Rectangular
Element Power Dissipation 0.063 W 0.063 W
First Element Resistance 75 Ω 75 Ω
JESD-609 Code e3 e3
Mounting Feature SURFACE MOUNT SURFACE MOUNT
Network Type ISOLATED ISOLATED
Number of Elements 1 1
Number of Functions 8 8
Number of Terminals 16 16
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Package Height 0.45 mm 0.45 mm
Package Length 3.8 mm 3.8 mm
Package Shape RECTANGULAR PACKAGE RECTANGULAR PACKAGE
Package Style SMT SMT
Package Width 1.6 mm 1.6 mm
Packing Method TR, PAPER, 7 INCH TR, PUNCHED, 7 INCH
Rated Temperature 70 °C 70 °C
Resistance 75 Ω 75 Ω
Resistor Type ARRAY/NETWORK RESISTOR ARRAY/NETWORK RESISTOR
Second/Last Element Resistance 75 Ω 75 Ω
Size Code 0615 0615
Surface Mount YES YES
Technology METAL GLAZE/THICK FILM METAL GLAZE/THICK FILM
Temperature Coefficient 200 ppm/°C 200 ppm/°C
Terminal Finish Tin (Sn) - with Nickel (Ni) barrier MATTE TIN OVER NICKEL
Terminal Shape WRAPAROUND WRAPAROUND
Tolerance 5% 5%
Working Voltage 25 V 25 V
Base Number Matches 1 1
Factory Lead Time 18 Weeks
Additional Feature IEC60115-9
Rated Power Dissipation (P) 0.25 W
Reference Standard AEC-Q200

Compare MNR18E0APJ750 with alternatives

Compare EXB2HV750JV with alternatives