MNR04M0APJ304
vs
TSN2BTJ304V
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Active
Active
Ihs Manufacturer
ROHM CO LTD
TATEYAMA KAGAKU GROUP
Package Description
CHIP
Reach Compliance Code
compliant
unknown
Construction
Rectangular
Chip
Element Power Dissipation
0.063 W
First Element Resistance
300000 Ω
300000 Ω
JESD-609 Code
e3
Mounting Feature
SURFACE MOUNT
SURFACE MOUNT
Network Type
ISOLATED
ISOLATED
Number of Elements
1
1
Number of Functions
4
4
Number of Terminals
8
8
Operating Temperature-Max
155 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Package Height
0.35 mm
0.35 mm
Package Length
2 mm
1 mm
Package Shape
RECTANGULAR PACKAGE
Package Style
SMT
SMT
Package Width
1 mm
2 mm
Packing Method
TR, PAPER, 7 INCH
TAPE
Rated Temperature
70 °C
70 °C
Resistance
300000 Ω
300000 Ω
Resistor Type
ARRAY/NETWORK RESISTOR
ARRAY/NETWORK RESISTOR
Second/Last Element Resistance
300000 Ω
300000 Ω
Size Code
0408
0408
Surface Mount
YES
YES
Technology
METAL GLAZE/THICK FILM
METAL GLAZE/THICK FILM
Temperature Coefficient
200 ppm/°C
200 ppm/°C
Terminal Finish
TIN OVER NICKEL
Terminal Shape
WRAPAROUND
WRAPAROUND
Tolerance
5%
5%
Working Voltage
25 V
25 V
Base Number Matches
1
1
ECCN Code
EAR99
HTS Code
8533.21.00.20
Rated Power Dissipation (P)
0.063 W
Compare MNR04M0APJ304 with alternatives
Compare TSN2BTJ304V with alternatives