MNR04M0APJ164 vs TSN2BJ164 feature comparison

MNR04M0APJ164 ROHM Semiconductor

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TSN2BJ164 Tateyama Kagaku Group

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Pbfree Code Yes
Rohs Code Yes Yes
Part Life Cycle Code Active Active
Ihs Manufacturer ROHM CO LTD TATEYAMA KAGAKU GROUP
Package Description CHIP
Reach Compliance Code compliant unknown
Construction Rectangular Chip
Element Power Dissipation 0.063 W
First Element Resistance 160000 Ω
JESD-609 Code e3
Mounting Feature SURFACE MOUNT
Network Type ISOLATED ISOLATED
Number of Elements 1
Number of Functions 4
Number of Terminals 8 8
Operating Temperature-Max 155 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Package Height 0.35 mm 0.35 mm
Package Length 2 mm 2 mm
Package Shape RECTANGULAR PACKAGE
Package Style SMT SMT
Package Width 1 mm 1 mm
Packing Method TR, PAPER, 7 INCH Bulk
Rated Temperature 70 °C
Resistance 160000 Ω 160000 Ω
Resistor Type ARRAY/NETWORK RESISTOR ARRAY/NETWORK RESISTOR
Second/Last Element Resistance 160000 Ω
Size Code 0408 0804
Surface Mount YES
Technology METAL GLAZE/THICK FILM METAL GLAZE/THICK FILM
Temperature Coefficient 200 ppm/°C 200 ppm/°C
Terminal Finish TIN OVER NICKEL
Terminal Shape WRAPAROUND
Tolerance 5% 5%
Working Voltage 25 V 25 V
Base Number Matches 1 1
ECCN Code EAR99
Rated Power Dissipation (P) 0.063 W

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