MN103E010H
vs
IBM25PPC750GXEAR2533T
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Active
Obsolete
Ihs Manufacturer
PANASONIC CORP
IBM MICROELECTRONICS
Part Package Code
BGA
BGA
Package Description
BGA,
BGA,
Pin Count
292
292
Reach Compliance Code
unknown
unknown
ECCN Code
3A991.A.2
3A991.A.2
HTS Code
8542.31.00.01
8542.31.00.01
Bit Size
32
32
Clock Frequency-Max
133 MHz
200 MHz
Format
FLOATING POINT
FLOATING POINT
Integrated Cache
YES
YES
JESD-30 Code
X-PBGA-B292
S-CBGA-B292
Number of Terminals
292
292
Package Body Material
PLASTIC/EPOXY
CERAMIC, METAL-SEALED COFIRED
Package Code
BGA
BGA
Package Shape
UNSPECIFIED
SQUARE
Package Style
GRID ARRAY
GRID ARRAY
Qualification Status
Not Qualified
Not Qualified
Speed
133 MHz
800 MHz
Supply Voltage-Max
1.89 V
1.5 V
Supply Voltage-Min
1.71 V
1.4 V
Supply Voltage-Nom
1.8 V
1.45 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Terminal Form
BALL
BALL
Terminal Position
BOTTOM
BOTTOM
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR
MICROPROCESSOR, RISC
Base Number Matches
2
1
Address Bus Width
32
Boundary Scan
YES
External Data Bus Width
64
Length
21 mm
Low Power Mode
YES
Seated Height-Max
3.137 mm
Terminal Pitch
1 mm
Width
21 mm
Compare MN103E010H with alternatives
Compare IBM25PPC750GXEAR2533T with alternatives