MMSZ5242B-FL-H
vs
SZN6326SMS
feature comparison
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
FORMOSA MICROSEMI CO LTD
|
SOLID STATE DEVICES INC
|
| Reach Compliance Code |
unknown
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8541.10.00.50
|
8541.10.00.50
|
| Configuration |
SINGLE
|
SINGLE
|
| Diode Element Material |
SILICON
|
SILICON
|
| Diode Type |
ZENER DIODE
|
ZENER DIODE
|
| Dynamic Impedance-Max |
30 Ω
|
|
| JESD-30 Code |
R-PDSO-F2
|
O-LELF-R2
|
| Knee Impedance-Max |
600 Ω
|
|
| Number of Elements |
1
|
1
|
| Number of Terminals |
2
|
2
|
| Operating Temperature-Max |
150 °C
|
175 °C
|
| Operating Temperature-Min |
-65 °C
|
-65 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
GLASS
|
| Package Shape |
RECTANGULAR
|
ROUND
|
| Package Style |
SMALL OUTLINE
|
LONG FORM
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Polarity |
UNIDIRECTIONAL
|
UNIDIRECTIONAL
|
| Power Dissipation-Max |
0.5 W
|
0.5 W
|
| Reference Standard |
MIL-STD-750
|
|
| Reference Voltage-Nom |
12 V
|
12 V
|
| Reverse Current-Max |
1 µA
|
|
| Reverse Test Voltage |
9.1 V
|
|
| Surface Mount |
YES
|
YES
|
| Technology |
ZENER
|
ZENER
|
| Terminal Form |
FLAT
|
WRAP AROUND
|
| Terminal Position |
DUAL
|
END
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
|
| Voltage Tol-Max |
5%
|
5%
|
| Working Test Current |
20 mA
|
20 mA
|
| Base Number Matches |
1
|
4
|
| Package Description |
|
O-LELF-R2
|
| Pin Count |
|
2
|
| Additional Feature |
|
METALLURGICALLY BONDED
|
| Case Connection |
|
ISOLATED
|
| Qualification Status |
|
Not Qualified
|
|
|
|
Compare MMSZ5242B-FL-H with alternatives
Compare SZN6326SMS with alternatives