MMSZ5222B
vs
MQ1N5222DE3
feature comparison
| Rohs Code |
No
|
Yes
|
| Part Life Cycle Code |
Active
|
Obsolete
|
| Ihs Manufacturer |
MICRO COMMERCIAL COMPONENTS CORP
|
MICROSEMI CORP
|
| Package Description |
PLASTIC PACKAGE-2
|
ROHS COMPLIANT, HERMETIC SEALED, GLASS, DO-7, 2 PIN
|
| Pin Count |
2
|
2
|
| Reach Compliance Code |
compliant
|
unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8541.10.00.50
|
8541.10.00.50
|
| Configuration |
SINGLE
|
SINGLE
|
| Diode Element Material |
SILICON
|
SILICON
|
| Diode Type |
ZENER DIODE
|
ZENER DIODE
|
| Dynamic Impedance-Max |
30 Ω
|
|
| JESD-30 Code |
R-PDSO-G2
|
O-LALF-W2
|
| JESD-609 Code |
e0
|
e3
|
| Knee Impedance-Max |
1250 Ω
|
|
| Number of Elements |
1
|
1
|
| Number of Terminals |
2
|
2
|
| Package Body Material |
PLASTIC/EPOXY
|
GLASS
|
| Package Shape |
RECTANGULAR
|
ROUND
|
| Package Style |
SMALL OUTLINE
|
LONG FORM
|
| Peak Reflow Temperature (Cel) |
240
|
|
| Polarity |
UNIDIRECTIONAL
|
UNIDIRECTIONAL
|
| Power Dissipation-Max |
0.5 W
|
0.417 W
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Reference Voltage-Nom |
2.5 V
|
2.5 V
|
| Reverse Current-Max |
0.1 µA
|
|
| Surface Mount |
YES
|
NO
|
| Technology |
ZENER
|
ZENER
|
| Terminal Finish |
Tin/Lead (Sn/Pb)
|
MATTE TIN
|
| Terminal Form |
GULL WING
|
WIRE
|
| Terminal Position |
DUAL
|
AXIAL
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
|
| Voltage Tol-Max |
5%
|
1%
|
| Working Test Current |
20 mA
|
20 mA
|
| Base Number Matches |
5
|
4
|
| Part Package Code |
|
DO-7
|
| Case Connection |
|
ISOLATED
|
| JEDEC-95 Code |
|
DO-204AA
|
| Moisture Sensitivity Level |
|
1
|
| Operating Temperature-Max |
|
175 °C
|
| Operating Temperature-Min |
|
-65 °C
|
|
|
|
Compare MMSZ5222B with alternatives
Compare MQ1N5222DE3 with alternatives