MMSZ5221B vs MSP1N5221C-1TR feature comparison

MMSZ5221B Motorola Mobility LLC

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MSP1N5221C-1TR Microsemi Corporation

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Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer MOTOROLA INC MICROSEMI CORP
Package Description R-PDSO-G2 O-LALF-W2
Pin Count 2 2
Manufacturer Package Code CASE 425-04
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8541.10.00.50 8541.10.00.50
Configuration SINGLE SINGLE
Diode Element Material SILICON SILICON
Diode Type ZENER DIODE ZENER DIODE
Dynamic Impedance-Max 30 Ω
JESD-30 Code R-PDSO-G2 O-LALF-W2
JESD-609 Code e0 e0
Knee Impedance-Max 1200 Ω
Number of Elements 1 1
Number of Terminals 2 2
Operating Temperature-Max 150 °C 175 °C
Operating Temperature-Min -55 °C -65 °C
Package Body Material PLASTIC/EPOXY GLASS
Package Shape RECTANGULAR ROUND
Package Style SMALL OUTLINE LONG FORM
Polarity UNIDIRECTIONAL UNIDIRECTIONAL
Power Dissipation-Max 0.5 W 0.48 W
Qualification Status Not Qualified Not Qualified
Reference Voltage-Nom 2.4 V 2.4 V
Reverse Current-Max 100 µA
Surface Mount YES NO
Technology ZENER ZENER
Terminal Finish TIN LEAD TIN LEAD
Terminal Form GULL WING WIRE
Terminal Position DUAL AXIAL
Voltage Tol-Max 5% 2%
Working Test Current 20 mA 20 mA
Base Number Matches 3 1
Part Package Code DO-35
Case Connection ISOLATED
JEDEC-95 Code DO-204AH
Moisture Sensitivity Level 1

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