MMSZ5221B vs MQ1N5223C feature comparison

MMSZ5221B Micro Commercial Components

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MQ1N5223C Microsemi Corporation

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Rohs Code No No
Part Life Cycle Code Active Obsolete
Ihs Manufacturer MICRO COMMERCIAL COMPONENTS CORP MICROSEMI CORP
Package Description PLASTIC PACKAGE-2 O-LALF-W2
Pin Count 2 2
Reach Compliance Code compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8541.10.00.50 8541.10.00.50
Configuration SINGLE SINGLE
Diode Element Material SILICON SILICON
Diode Type ZENER DIODE ZENER DIODE
Dynamic Impedance-Max 30 Ω
JESD-30 Code R-PDSO-G2 O-LALF-W2
JESD-609 Code e0 e0
Knee Impedance-Max 1200 Ω
Number of Elements 1 1
Number of Terminals 2 2
Package Body Material PLASTIC/EPOXY GLASS
Package Shape RECTANGULAR ROUND
Package Style SMALL OUTLINE LONG FORM
Peak Reflow Temperature (Cel) 240
Polarity UNIDIRECTIONAL UNIDIRECTIONAL
Power Dissipation-Max 0.5 W 0.48 W
Qualification Status Not Qualified
Reference Voltage-Nom 2.4 V 2.7 V
Reverse Current-Max 0.1 µA
Surface Mount YES NO
Technology ZENER ZENER
Terminal Finish Tin/Lead (Sn/Pb) TIN LEAD
Terminal Form GULL WING WIRE
Terminal Position DUAL AXIAL
Time@Peak Reflow Temperature-Max (s) 30
Voltage Tol-Max 5% 2%
Working Test Current 20 mA 20 mA
Base Number Matches 5 15
Pbfree Code No
Part Package Code DO-7
Case Connection ISOLATED
JEDEC-95 Code DO-204AH
Operating Temperature-Max 175 °C
Operating Temperature-Min -65 °C
Reference Standard MIL-19500

Compare MMSZ5221B with alternatives

Compare MQ1N5223C with alternatives