MMSZ3V6T3
vs
MSP1N5227BTR
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
MOTOROLA INC
MICROSEMI CORP
Package Description
R-PDSO-G2
HERMETIC SEALED, GLASS, DO-7, 2 PIN
Pin Count
2
2
Manufacturer Package Code
CASE 425
Reach Compliance Code
unknown
unknown
ECCN Code
EAR99
EAR99
HTS Code
8541.10.00.50
8541.10.00.50
Configuration
SINGLE
SINGLE
Diode Element Material
SILICON
SILICON
Diode Type
ZENER DIODE
ZENER DIODE
JESD-30 Code
R-PDSO-G2
O-LALF-W2
JESD-609 Code
e0
e0
Number of Elements
1
1
Number of Terminals
2
2
Operating Temperature-Max
150 °C
175 °C
Operating Temperature-Min
-55 °C
-65 °C
Package Body Material
PLASTIC/EPOXY
GLASS
Package Shape
RECTANGULAR
ROUND
Package Style
SMALL OUTLINE
LONG FORM
Polarity
UNIDIRECTIONAL
UNIDIRECTIONAL
Power Dissipation-Max
0.5 W
0.417 W
Qualification Status
Not Qualified
Not Qualified
Reference Voltage-Nom
3.6 V
3.6 V
Reverse Current-Max
5 µA
Surface Mount
YES
NO
Technology
ZENER
ZENER
Terminal Finish
Tin/Lead (Sn/Pb)
TIN LEAD
Terminal Form
GULL WING
WIRE
Terminal Position
DUAL
AXIAL
Voltage Tol-Max
5%
5%
Working Test Current
5 mA
20 mA
Base Number Matches
3
1
Rohs Code
Part Package Code
DO-7
Case Connection
ISOLATED
JEDEC-95 Code
DO-204AA
Moisture Sensitivity Level
1
Compare MMSZ3V6T3 with alternatives
Compare MSP1N5227BTR with alternatives