MMSF6N01HD
vs
AP2306AGN
feature comparison
| Part Life Cycle Code |
Obsolete
|
Contact Manufacturer
|
| Ihs Manufacturer |
MOTOROLA INC
|
ADVANCED POWER ELECTRONICS CORP
|
| Package Description |
SMALL OUTLINE, R-PDSO-G8
|
SMALL OUTLINE, R-PDSO-G3
|
| Reach Compliance Code |
unknown
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| Configuration |
SEPARATE, 2 ELEMENTS
|
SINGLE WITH BUILT-IN DIODE
|
| DS Breakdown Voltage-Min |
12 V
|
30 V
|
| Drain Current-Max (ID) |
6 A
|
5 A
|
| Drain-source On Resistance-Max |
0.045 Ω
|
0.035 Ω
|
| FET Technology |
METAL-OXIDE SEMICONDUCTOR
|
METAL-OXIDE SEMICONDUCTOR
|
| JESD-30 Code |
R-PDSO-G8
|
R-PDSO-G3
|
| Number of Elements |
2
|
1
|
| Number of Terminals |
8
|
3
|
| Operating Mode |
ENHANCEMENT MODE
|
ENHANCEMENT MODE
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE
|
SMALL OUTLINE
|
| Polarity/Channel Type |
N-CHANNEL
|
N-CHANNEL
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Surface Mount |
YES
|
YES
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Position |
DUAL
|
DUAL
|
| Transistor Application |
SWITCHING
|
|
| Transistor Element Material |
SILICON
|
SILICON
|
| Base Number Matches |
3
|
2
|
| Pin Count |
|
3
|
| Operating Temperature-Max |
|
150 °C
|
| Pulsed Drain Current-Max (IDM) |
|
20 A
|
|
|
|
Compare MMSF6N01HD with alternatives
Compare AP2306AGN with alternatives