MMQM-67005L-35/883
vs
MMQM-67005L-35
feature comparison
| Rohs Code |
No
|
|
| Part Life Cycle Code |
Transferred
|
Obsolete
|
| Ihs Manufacturer |
TEMIC SEMICONDUCTORS
|
ATMEL CORP
|
| Reach Compliance Code |
unknown
|
unknown
|
| ECCN Code |
3A001.A.2.C
|
EAR99
|
| HTS Code |
8542.32.00.41
|
8542.32.00.41
|
| Access Time-Max |
35 ns
|
|
| I/O Type |
COMMON
|
|
| JESD-30 Code |
S-XQCC-J68
|
|
| JESD-609 Code |
e0
|
|
| Memory Density |
65536 bit
|
|
| Memory IC Type |
MULTI-PORT SRAM
|
MULTI-PORT SRAM
|
| Memory Width |
8
|
|
| Number of Ports |
2
|
|
| Number of Terminals |
68
|
|
| Number of Words |
8192 words
|
|
| Number of Words Code |
8000
|
|
| Operating Mode |
ASYNCHRONOUS
|
|
| Operating Temperature-Max |
125 °C
|
|
| Operating Temperature-Min |
-55 °C
|
|
| Organization |
8KX8
|
|
| Output Characteristics |
3-STATE
|
|
| Package Body Material |
CERAMIC
|
|
| Package Code |
QCCJ
|
|
| Package Equivalence Code |
LDCC68,1.0SQ
|
|
| Package Shape |
SQUARE
|
|
| Package Style |
CHIP CARRIER
|
|
| Parallel/Serial |
PARALLEL
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Screening Level |
38535Q/M;38534H;883B
|
|
| Standby Current-Max |
0.00004 A
|
|
| Standby Voltage-Min |
2 V
|
|
| Supply Current-Max |
0.3 mA
|
|
| Supply Voltage-Nom (Vsup) |
5 V
|
|
| Surface Mount |
YES
|
|
| Technology |
CMOS
|
|
| Temperature Grade |
MILITARY
|
|
| Terminal Finish |
Tin/Lead (Sn/Pb)
|
|
| Terminal Form |
J BEND
|
|
| Terminal Pitch |
1.27 mm
|
|
| Terminal Position |
QUAD
|
|
| Base Number Matches |
2
|
3
|
| Package Description |
|
,
|
|
|
|