MMDF2P01HDR2
vs
NTMD4N03R2G
feature comparison
| Rohs Code |
No
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Active
|
| Ihs Manufacturer |
MOTOROLA SEMICONDUCTOR PRODUCTS
|
ROCHESTER ELECTRONICS LLC
|
| Package Description |
,
|
ROHS COMPLIANT, MINIATURE, CASE 751-07, SOIC-8
|
| Reach Compliance Code |
unknown
|
unknown
|
| Drain Current-Max (Abs) (ID) |
3.4 A
|
|
| FET Technology |
METAL-OXIDE SEMICONDUCTOR
|
METAL-OXIDE SEMICONDUCTOR
|
| Operating Mode |
ENHANCEMENT MODE
|
ENHANCEMENT MODE
|
| Operating Temperature-Max |
150 °C
|
|
| Polarity/Channel Type |
P-CHANNEL
|
N-CHANNEL
|
| Power Dissipation-Max (Abs) |
2 W
|
|
| Surface Mount |
YES
|
YES
|
| Base Number Matches |
5
|
2
|
| Pbfree Code |
|
No
|
| Part Package Code |
|
SOT
|
| Pin Count |
|
8
|
| Manufacturer Package Code |
|
CASE 751-07
|
| Avalanche Energy Rating (Eas) |
|
80 mJ
|
| Configuration |
|
SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE
|
| DS Breakdown Voltage-Min |
|
30 V
|
| Drain Current-Max (ID) |
|
4 A
|
| Drain-source On Resistance-Max |
|
0.06 Ω
|
| JESD-30 Code |
|
R-PDSO-G8
|
| JESD-609 Code |
|
e3
|
| Moisture Sensitivity Level |
|
NOT SPECIFIED
|
| Number of Elements |
|
2
|
| Number of Terminals |
|
8
|
| Package Body Material |
|
PLASTIC/EPOXY
|
| Package Shape |
|
RECTANGULAR
|
| Package Style |
|
SMALL OUTLINE
|
| Peak Reflow Temperature (Cel) |
|
260
|
| Pulsed Drain Current-Max (IDM) |
|
12 A
|
| Qualification Status |
|
COMMERCIAL
|
| Terminal Finish |
|
MATTE TIN
|
| Terminal Form |
|
GULL WING
|
| Terminal Position |
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
|
40
|
| Transistor Application |
|
SWITCHING
|
| Transistor Element Material |
|
SILICON
|
|
|
|
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