MMCP-67204EV-50
vs
5962-8956804XA
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
TEMIC SEMICONDUCTORS
MATRA MHS
Package Description
0.300 INCH, SIDE BRAZED, CERAMIC, DIP-28
CERAMIC, DIP-28
Reach Compliance Code
unknown
unknown
Access Time-Max
50 ns
50 ns
Clock Frequency-Max (fCLK)
15.3 MHz
Cycle Time
65 ns
65 ns
JESD-30 Code
R-CDIP-T28
R-GDIP-T28
JESD-609 Code
e0
e0
Memory Density
36864 bit
36864 bit
Memory IC Type
OTHER FIFO
OTHER FIFO
Memory Width
9
9
Number of Functions
1
1
Number of Terminals
28
28
Number of Words
4096 words
4096 words
Number of Words Code
4000
4000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Organization
4KX9
4KX9
Output Enable
NO
NO
Package Body Material
CERAMIC, METAL-SEALED COFIRED
CERAMIC, GLASS-SEALED
Package Code
DIP
DIP
Package Equivalence Code
DIP28,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Standby Current-Max
0.0002 A
Supply Current-Max
0.125 mA
0.125 mA
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
MILITARY
MILITARY
Terminal Finish
Tin/Lead (Sn/Pb)
TIN LEAD
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Base Number Matches
2
6
Part Package Code
DIP
Pin Count
28
ECCN Code
EAR99
HTS Code
8542.32.00.71
Additional Feature
RETRANSMIT
Length
37.1475 mm
Screening Level
MIL-STD-883
Seated Height-Max
5.08 mm
Width
7.62 mm
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