MMCP-67204EV-50 vs 5962-8956804XA feature comparison

MMCP-67204EV-50 Temic Semiconductors

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5962-8956804XA Matra MHS

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Rohs Code No
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer TEMIC SEMICONDUCTORS MATRA MHS
Package Description 0.300 INCH, SIDE BRAZED, CERAMIC, DIP-28 CERAMIC, DIP-28
Reach Compliance Code unknown unknown
Access Time-Max 50 ns 50 ns
Clock Frequency-Max (fCLK) 15.3 MHz
Cycle Time 65 ns 65 ns
JESD-30 Code R-CDIP-T28 R-GDIP-T28
JESD-609 Code e0 e0
Memory Density 36864 bit 36864 bit
Memory IC Type OTHER FIFO OTHER FIFO
Memory Width 9 9
Number of Functions 1 1
Number of Terminals 28 28
Number of Words 4096 words 4096 words
Number of Words Code 4000 4000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Organization 4KX9 4KX9
Output Enable NO NO
Package Body Material CERAMIC, METAL-SEALED COFIRED CERAMIC, GLASS-SEALED
Package Code DIP DIP
Package Equivalence Code DIP28,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Standby Current-Max 0.0002 A
Supply Current-Max 0.125 mA 0.125 mA
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade MILITARY MILITARY
Terminal Finish Tin/Lead (Sn/Pb) TIN LEAD
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Base Number Matches 2 6
Part Package Code DIP
Pin Count 28
ECCN Code EAR99
HTS Code 8542.32.00.71
Additional Feature RETRANSMIT
Length 37.1475 mm
Screening Level MIL-STD-883
Seated Height-Max 5.08 mm
Width 7.62 mm

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