MMCP-65656L55SHXXX
vs
U634H256BDK45G1
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
ATMEL CORP
SIMTEK CORP
Part Package Code
DIP
DIP
Package Description
DIP,
DIP,
Pin Count
28
28
Reach Compliance Code
unknown
unknown
Access Time-Max
55 ns
45 ns
JESD-30 Code
R-CDIP-T28
R-PDIP-T28
Memory Density
262144 bit
262144 bit
Memory IC Type
STANDARD SRAM
NON-VOLATILE SRAM
Memory Width
8
8
Number of Functions
1
1
Number of Terminals
28
28
Number of Words
32768 words
32768 words
Number of Words Code
32000
32000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
125 °C
85 °C
Operating Temperature-Min
-55 °C
-40 °C
Organization
32KX8
32KX8
Package Body Material
CERAMIC, METAL-SEALED COFIRED
PLASTIC/EPOXY
Package Code
DIP
DIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
5.84 mm
5.1 mm
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
MILITARY
INDUSTRIAL
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Width
7.62 mm
7.62 mm
Base Number Matches
1
3
Pbfree Code
ECCN Code
EAR99
HTS Code
8542.32.00.41
JESD-609 Code
e3
Length
34.7 mm
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Terminal Finish
MATTE TIN
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Compare MMCP-65656L55SHXXX with alternatives
Compare U634H256BDK45G1 with alternatives