MMBZ33VAL
vs
SZMMBZ33VALT3
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Ihs Manufacturer
NXP SEMICONDUCTORS
Part Package Code
SOT-23
Package Description
PLASTIC PACKAGE-3
Pin Count
3
Reach Compliance Code
compliant
ECCN Code
EAR99
HTS Code
8541.10.00.50
Samacsys Manufacturer
NXP
Breakdown Voltage-Max
34.65 V
Breakdown Voltage-Min
31.35 V
Breakdown Voltage-Nom
33 V
Clamping Voltage-Max
46 V
Configuration
COMMON ANODE, 2 ELEMENTS
Diode Element Material
SILICON
Diode Type
TRANS VOLTAGE SUPPRESSOR DIODE
JEDEC-95 Code
TO-236AB
JESD-30 Code
R-PDSO-G3
JESD-609 Code
e3
Moisture Sensitivity Level
1
Non-rep Peak Rev Power Dis-Max
40 W
Number of Elements
2
Number of Terminals
3
Package Body Material
PLASTIC/EPOXY
Package Shape
RECTANGULAR
Package Style
SMALL OUTLINE
Peak Reflow Temperature (Cel)
260
Polarity
UNIDIRECTIONAL
Power Dissipation-Max
0.36 W
Qualification Status
Not Qualified
Rep Pk Reverse Voltage-Max
26 V
Surface Mount
YES
Technology
AVALANCHE
Terminal Finish
Tin (Sn)
Terminal Form
GULL WING
Terminal Position
DUAL
Time@Peak Reflow Temperature-Max (s)
30
Base Number Matches
4
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