MMBF0201NLT1
vs
MMBF0201NLT1G
feature comparison
Rohs Code |
No
|
|
Part Life Cycle Code |
Obsolete
|
Active
|
Ihs Manufacturer |
MOTOROLA SEMICONDUCTOR PRODUCTS
|
ONSEMI
|
Package Description |
,
|
ROHS COMPLIANT, CASE 318-08, 3 PIN
|
Reach Compliance Code |
unknown
|
compliant
|
Configuration |
Single
|
SINGLE WITH BUILT-IN DIODE
|
Drain Current-Max (Abs) (ID) |
0.3 A
|
|
FET Technology |
METAL-OXIDE SEMICONDUCTOR
|
METAL-OXIDE SEMICONDUCTOR
|
Operating Mode |
ENHANCEMENT MODE
|
ENHANCEMENT MODE
|
Operating Temperature-Max |
150 °C
|
150 °C
|
Polarity/Channel Type |
N-CHANNEL
|
N-CHANNEL
|
Power Dissipation-Max (Abs) |
0.225 W
|
0.225 W
|
Surface Mount |
YES
|
YES
|
Base Number Matches |
4
|
1
|
Pbfree Code |
|
Yes
|
Part Package Code |
|
SOT-23 (TO-236) 3 LEAD
|
Pin Count |
|
3
|
Manufacturer Package Code |
|
318-08
|
ECCN Code |
|
EAR99
|
Factory Lead Time |
|
2 Days
|
Samacsys Manufacturer |
|
onsemi
|
DS Breakdown Voltage-Min |
|
20 V
|
Drain Current-Max (ID) |
|
0.3 A
|
Drain-source On Resistance-Max |
|
1 Ω
|
JEDEC-95 Code |
|
TO-236AB
|
JESD-30 Code |
|
R-PDSO-G3
|
JESD-609 Code |
|
e3
|
Moisture Sensitivity Level |
|
1
|
Number of Elements |
|
1
|
Number of Terminals |
|
3
|
Package Body Material |
|
PLASTIC/EPOXY
|
Package Shape |
|
RECTANGULAR
|
Package Style |
|
SMALL OUTLINE
|
Peak Reflow Temperature (Cel) |
|
260
|
Qualification Status |
|
Not Qualified
|
Terminal Finish |
|
MATTE TIN
|
Terminal Form |
|
GULL WING
|
Terminal Position |
|
DUAL
|
Time@Peak Reflow Temperature-Max (s) |
|
30
|
Transistor Application |
|
SWITCHING
|
Transistor Element Material |
|
SILICON
|
|
|
|
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