MMBD353LT1G
vs
MMBD452LT1G
feature comparison
| Pbfree Code |
No
|
Yes
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
ROCHESTER ELECTRONICS LLC
|
ONSEMI
|
| Part Package Code |
SOT-23
|
SOT-23 (TO-236) 3 LEAD
|
| Package Description |
HALOGEN FREE AND ROHS COMPLIANT, CASE 318-08, 3 PIN
|
HALOGEN FREE AND ROHS COMPLIANT, PLASTIC, CASE 318-08, 3 PIN
|
| Pin Count |
3
|
3
|
| Manufacturer Package Code |
CASE 318-08
|
318-08
|
| Reach Compliance Code |
unknown
|
compliant
|
| Configuration |
SERIES CONNECTED, CENTER TAP, 2 ELEMENTS
|
SERIES CONNECTED, CENTER TAP, 2 ELEMENTS
|
| Diode Capacitance-Max |
1 pF
|
1.5 pF
|
| Diode Element Material |
SILICON
|
SILICON
|
| Diode Type |
MIXER DIODE
|
MIXER DIODE
|
| Frequency Band |
ULTRA HIGH FREQUENCY
|
VERY HIGH FREQUENCY TO ULTRA HIGH FREQUENCY
|
| JEDEC-95 Code |
TO-236AB
|
TO-236AB
|
| JESD-30 Code |
R-PDSO-G3
|
R-PDSO-G3
|
| JESD-609 Code |
e3
|
e3
|
| Moisture Sensitivity Level |
NOT SPECIFIED
|
1
|
| Number of Elements |
2
|
2
|
| Number of Terminals |
3
|
3
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE
|
SMALL OUTLINE
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Power Dissipation-Max |
0.225 W
|
0.225 W
|
| Qualification Status |
COMMERCIAL
|
Not Qualified
|
| Surface Mount |
YES
|
YES
|
| Terminal Finish |
MATTE TIN
|
MATTE TIN
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
40
|
30
|
| Base Number Matches |
2
|
1
|
| ECCN Code |
|
EAR99
|
| HTS Code |
|
8541.10.00.60
|
| Factory Lead Time |
|
4 Weeks
|
| Samacsys Manufacturer |
|
onsemi
|
| Operating Temperature-Max |
|
125 °C
|
| Operating Temperature-Min |
|
-55 °C
|
| Technology |
|
SCHOTTKY
|
| Type of Schottky Barrier |
|
LOW BARRIER
|
|
|
|
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