MMA6270Q
vs
MMA6361LR2
feature comparison
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Obsolete
|
Transferred
|
Ihs Manufacturer |
FREESCALE SEMICONDUCTOR INC
|
FREESCALE SEMICONDUCTOR INC
|
Part Package Code |
QFN
|
LGA
|
Package Description |
6 X 6 MM, ROHS COMPLIANT, QFN-16
|
TFBGA, LCC14,.12X.2,32
|
Pin Count |
16
|
14
|
Reach Compliance Code |
unknown
|
unknown
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Analog IC - Other Type |
ANALOG CIRCUIT
|
ANALOG CIRCUIT
|
JESD-30 Code |
S-XQCC-N16
|
R-PBGA-B14
|
JESD-609 Code |
e3
|
|
Length |
6 mm
|
5 mm
|
Moisture Sensitivity Level |
3
|
3
|
Number of Functions |
1
|
1
|
Number of Terminals |
16
|
14
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-20 °C
|
-40 °C
|
Package Body Material |
UNSPECIFIED
|
PLASTIC/EPOXY
|
Package Code |
HQCCN
|
TFBGA
|
Package Equivalence Code |
LCC16,.23SQ,40
|
LCC14,.12X.2,32
|
Package Shape |
SQUARE
|
RECTANGULAR
|
Package Style |
CHIP CARRIER, HEAT SINK/SLUG
|
GRID ARRAY
|
Peak Reflow Temperature (Cel) |
260
|
260
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
1.55 mm
|
1.05 mm
|
Supply Voltage-Max (Vsup) |
3.6 V
|
3.6 V
|
Supply Voltage-Min (Vsup) |
2.2 V
|
2.2 V
|
Supply Voltage-Nom (Vsup) |
3.3 V
|
3.3 V
|
Surface Mount |
YES
|
YES
|
Temperature Grade |
OTHER
|
INDUSTRIAL
|
Terminal Finish |
MATTE TIN
|
|
Terminal Form |
NO LEAD
|
BUTT
|
Terminal Pitch |
0.5 mm
|
0.8 mm
|
Terminal Position |
QUAD
|
BOTTOM
|
Time@Peak Reflow Temperature-Max (s) |
40
|
40
|
Width |
6 mm
|
3 mm
|
Base Number Matches |
1
|
2
|
Pbfree Code |
|
No
|
ECCN Code |
|
EAR99
|
Samacsys Manufacturer |
|
NXP
|
|
|
|
Compare MMA6270Q with alternatives
Compare MMA6361LR2 with alternatives