MMA20312BVT1
vs
RMWD38001
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
NXP SEMICONDUCTORS
RAYTHEON RF COMPONENTS
Package Description
3 X 3 MM, 0.85 MM HEIGHT, ROHS COMPLIANT, PLASTIC, CASE 2131-01, QFN-12
DIE OR CHIP
Reach Compliance Code
unknown
unknown
ECCN Code
EAR99
HTS Code
8542.33.00.01
Factory Lead Time
4 Weeks
Samacsys Manufacturer
NXP
Characteristic Impedance
50 Ω
Construction
COMPONENT
Gain
23.6 dB
Input Power-Max (CW)
14 dBm
JESD-609 Code
e3
Mounting Feature
SURFACE MOUNT
Number of Functions
1
1
Number of Terminals
12
Operating Frequency-Max
2200 MHz
Operating Frequency-Min
1800 MHz
Package Body Material
PLASTIC/EPOXY
Package Equivalence Code
LCC12,.12SQ,20
DIE OR CHIP
Power Supplies
5 V
4 V
RF/Microwave Device Type
NARROW BAND MEDIUM POWER
Supply Current-Max
77 mA
Surface Mount
YES
Technology
BIPOLAR
GAAS
Terminal Finish
MATTE TIN
Base Number Matches
2
2
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