MM912F634DV2AE
vs
MM912F634CV2AE
feature comparison
| Pbfree Code |
Yes
|
Yes
|
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Transferred
|
Obsolete
|
| Ihs Manufacturer |
FREESCALE SEMICONDUCTOR INC
|
FREESCALE SEMICONDUCTOR INC
|
| Part Package Code |
QFP
|
QFP
|
| Package Description |
7 X 7 MM, 1.40 MM HEIGHT, 0.50 MM PITCH, LQFP-48
|
7 X 7 MM, 1.40 MM HEIGHT, 0.50 MM PITCH, ROHS COMPLIANT, PLASTIC, MS-026BBC, LQFP-48
|
| Pin Count |
48
|
48
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
3A991.A.2
|
3A991.A.2
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Samacsys Manufacturer |
NXP
|
|
| JESD-30 Code |
S-PQFP-G48
|
S-PQFP-G48
|
| JESD-609 Code |
e3
|
e3
|
| Length |
7 mm
|
7 mm
|
| Moisture Sensitivity Level |
3
|
3
|
| Number of Terminals |
48
|
48
|
| Operating Temperature-Max |
105 °C
|
105 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
HLFQFP
|
HLFQFP
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH
|
FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Seated Height-Max |
1.6 mm
|
1.6 mm
|
| Supply Voltage-Max |
18 V
|
18 V
|
| Supply Voltage-Min |
5.5 V
|
5.5 V
|
| Supply Voltage-Nom |
7 V
|
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
Matte Tin (Sn)
|
MATTE TIN
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
0.5 mm
|
0.5 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Time@Peak Reflow Temperature-Max (s) |
40
|
40
|
| Width |
7 mm
|
7 mm
|
| uPs/uCs/Peripheral ICs Type |
MICROPROCESSOR CIRCUIT
|
MICROPROCESSOR CIRCUIT
|
| Base Number Matches |
2
|
2
|
| Qualification Status |
|
Not Qualified
|
|
|
|
Compare MM912F634DV2AE with alternatives
Compare MM912F634CV2AE with alternatives