MM74HCT574J
vs
MC54HCT574AJ
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
NATIONAL SEMICONDUCTOR CORP
MOTOROLA SEMICONDUCTOR PRODUCTS
Part Package Code
DIP
Package Description
DIP, DIP20,.3
DIP, DIP20,.3
Pin Count
20
Reach Compliance Code
unknown
unknown
HTS Code
8542.39.00.01
Additional Feature
BROADSIDE VERSION OF 374
Family
HCT
JESD-30 Code
R-GDIP-T20
R-XDIP-T20
JESD-609 Code
e0
e0
Length
24.51 mm
Load Capacitance (CL)
150 pF
50 pF
Logic IC Type
BUS DRIVER
D FLIP-FLOP
Max I(ol)
0.006 A
0.006 A
Number of Bits
8
Number of Functions
1
8
Number of Ports
2
Number of Terminals
20
20
Operating Temperature-Max
85 °C
125 °C
Operating Temperature-Min
-40 °C
-55 °C
Output Characteristics
3-STATE
3-STATE
Output Polarity
TRUE
Package Body Material
CERAMIC, GLASS-SEALED
CERAMIC
Package Code
DIP
DIP
Package Equivalence Code
DIP20,.3
DIP20,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Propagation Delay (tpd)
47 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
5.08 mm
Supply Voltage-Max (Vsup)
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
MILITARY
Terminal Finish
TIN LEAD
Tin/Lead (Sn/Pb)
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Trigger Type
POSITIVE EDGE
POSITIVE EDGE
Width
7.62 mm
Base Number Matches
2
4
Max Frequency@Nom-Sup
20000000 Hz
Power Supplies
5 V
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