MM74HCT373WM
vs
SN54LS541J
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
FAIRCHILD SEMICONDUCTOR CORP
MOTOROLA INC
Part Package Code
SOIC
DIP
Package Description
0.300 INCH, MS-013, SOIC-20
DIP,
Pin Count
20
20
Manufacturer Package Code
20LD, SOIC, JEDEC MS013, .300", WIDE BODY
Reach Compliance Code
compliant
unknown
ECCN Code
EAR99
HTS Code
8542.39.00.01
8542.39.00.01
Family
HCT
LS
JESD-30 Code
R-PDSO-G20
R-CDIP-T20
JESD-609 Code
e3
e0
Length
12.8 mm
24.515 mm
Load Capacitance (CL)
50 pF
45 pF
Logic IC Type
BUS DRIVER
BUS DRIVER
Max I(ol)
0.006 A
Moisture Sensitivity Level
1
Number of Bits
8
8
Number of Functions
1
1
Number of Ports
2
2
Number of Terminals
20
20
Operating Temperature-Max
85 °C
125 °C
Operating Temperature-Min
-40 °C
-55 °C
Output Characteristics
3-STATE
3-STATE
Output Polarity
TRUE
TRUE
Package Body Material
PLASTIC/EPOXY
CERAMIC, METAL-SEALED COFIRED
Package Code
SOP
DIP
Package Equivalence Code
SOP20,.4
DIP20,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE
IN-LINE
Peak Reflow Temperature (Cel)
260
Prop. Delay@Nom-Sup
37 ns
Propagation Delay (tpd)
56 ns
18 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
2.65 mm
5.08 mm
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
NO
Technology
CMOS
TTL
Temperature Grade
INDUSTRIAL
MILITARY
Terminal Finish
MATTE TIN
TIN LEAD
Terminal Form
GULL WING
THROUGH-HOLE
Terminal Pitch
1.27 mm
2.54 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
30
Width
7.5 mm
7.62 mm
Base Number Matches
4
5
Additional Feature
WITH DUAL OUTPUT ENABLE; MIN INPUT HYSTERESIS = 0.2V
Power Supply Current-Max (ICC)
52 mA
Compare MM74HCT373WM with alternatives
Compare SN54LS541J with alternatives