MM74HCT273SJ
vs
TC74HCT273AF(TP2)
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Active
Active
Ihs Manufacturer
ROCHESTER ELECTRONICS INC
TOSHIBA CORP
Part Package Code
SOIC
SOIC
Package Description
SOP,
0.300 INCH, PLASTIC, SOIC-20
Pin Count
20
20
Reach Compliance Code
unknown
unknown
Family
HCT
HCT
JESD-30 Code
R-PDSO-G20
R-PDSO-G20
JESD-609 Code
e3
e0
Length
12.6 mm
12.8 mm
Logic IC Type
D FLIP-FLOP
D FLIP-FLOP
Moisture Sensitivity Level
1
Number of Bits
8
8
Number of Functions
1
1
Number of Terminals
20
20
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Output Polarity
TRUE
TRUE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
SOP
SOP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE
SMALL OUTLINE
Peak Reflow Temperature (Cel)
260
240
Propagation Delay (tpd)
46 ns
38 ns
Qualification Status
COMMERCIAL
Not Qualified
Seated Height-Max
2.1 mm
1.9 mm
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
MATTE TIN
TIN LEAD
Terminal Form
GULL WING
GULL WING
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
30
NOT SPECIFIED
Trigger Type
POSITIVE EDGE
POSITIVE EDGE
Width
5.3 mm
5.3 mm
fmax-Min
21 MHz
24 MHz
Base Number Matches
3
1
Load Capacitance (CL)
50 pF
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