MM74HCT157M vs M74HCT157RM13TR feature comparison

MM74HCT157M National Semiconductor Corporation

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M74HCT157RM13TR STMicroelectronics

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Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer NATIONAL SEMICONDUCTOR CORP STMICROELECTRONICS
Package Description SOP, SOP16,.25 SOP, SOP16,.25
Reach Compliance Code unknown not_compliant
HTS Code 8542.39.00.01 8542.39.00.01
Family HCT HCT
JESD-30 Code R-PDSO-G16 R-PDSO-G16
JESD-609 Code e0 e4
Length 9.9 mm 9.9 mm
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type MULTIPLEXER MULTIPLEXER
Number of Functions 4 4
Number of Inputs 2 2
Number of Outputs 1 1
Number of Terminals 16 16
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -55 °C
Output Polarity TRUE TRUE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP SOP
Package Equivalence Code SOP16,.25 SOP16,.25
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Propagation Delay (tpd) 34 ns 38 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.75 mm 1.75 mm
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL MILITARY
Terminal Finish TIN LEAD Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form GULL WING GULL WING
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position DUAL DUAL
Width 3.9 mm 3.9 mm
Base Number Matches 2 1
Pbfree Code Yes
Part Package Code SOIC
Pin Count 16
Max I(ol) 0.004 A
Moisture Sensitivity Level 3
Packing Method TR
Peak Reflow Temperature (Cel) 260
Prop. Delay@Nom-Sup 38 ns
Time@Peak Reflow Temperature-Max (s) 30

Compare MM74HCT157M with alternatives

Compare M74HCT157RM13TR with alternatives