MM74HCT08SJ
vs
TC74HCT08AF-TP2EL
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
End Of Life
Ihs Manufacturer
ON SEMICONDUCTOR
TOSHIBA CORP
Package Description
SOP, SOP14,.3
SOP,
Manufacturer Package Code
565BE
Reach Compliance Code
compliant
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Factory Lead Time
4 Weeks
Family
HCT
HCT
JESD-30 Code
R-PDSO-G14
R-PDSO-G14
JESD-609 Code
e3
e2
Length
10.2 mm
10.3 mm
Load Capacitance (CL)
50 pF
50 pF
Logic IC Type
AND GATE
AND GATE
Max I(ol)
0.004 A
Moisture Sensitivity Level
1
Number of Functions
4
4
Number of Inputs
2
2
Number of Terminals
14
14
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
SOP
SOP
Package Equivalence Code
SOP14,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE
SMALL OUTLINE
Peak Reflow Temperature (Cel)
260
Power Supply Current-Max (ICC)
1.5 mA
Prop. Delay@Nom-Sup
23 ns
Propagation Delay (tpd)
23 ns
25 ns
Qualification Status
Not Qualified
Not Qualified
Schmitt Trigger
NO
Seated Height-Max
2.1 mm
1.9 mm
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
TIN
TIN COPPER/TIN SILVER
Terminal Form
GULL WING
GULL WING
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
30
Width
5.3 mm
5.3 mm
Base Number Matches
2
1
Part Package Code
SOIC
Pin Count
14
Compare MM74HCT08SJ with alternatives
Compare TC74HCT08AF-TP2EL with alternatives