MM74HCT00N vs TC74HC132AFN feature comparison

MM74HCT00N Fairchild Semiconductor Corporation

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TC74HC132AFN Toshiba America Electronic Components

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Pbfree Code Yes Yes
Rohs Code Yes Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer FAIRCHILD SEMICONDUCTOR CORP TOSHIBA CORP
Part Package Code DIP SOIC
Package Description 0.300 INCH, PLASTIC, MS-001, DIP-14 SOP, SOP14,.25
Pin Count 14 14
Manufacturer Package Code 14LD, MDIP,JEDEC MS-001, .300" WIDE
Reach Compliance Code unknown unknown
ECCN Code EAR99
HTS Code 8542.39.00.01 8542.39.00.01
Family HCT HC/UH
JESD-30 Code R-PDIP-T14 R-PDSO-G14
JESD-609 Code e3
Length 19.18 mm 8.65 mm
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type NAND GATE NAND GATE
Max I(ol) 0.004 A 0.004 A
Number of Functions 4 4
Number of Inputs 2 2
Number of Terminals 14 14
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP SOP
Package Equivalence Code DIP14,.3 SOP14,.25
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE SMALL OUTLINE
Packing Method RAIL
Prop. Delay@Nom-Sup 29 ns 28 ns
Propagation Delay (tpd) 29 ns 140 ns
Qualification Status Not Qualified Not Qualified
Schmitt Trigger NO YES
Seated Height-Max 5.08 mm 1.75 mm
Supply Voltage-Max (Vsup) 5.5 V 6 V
Supply Voltage-Min (Vsup) 4.5 V 2 V
Supply Voltage-Nom (Vsup) 5 V 4.5 V
Surface Mount NO YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish MATTE TIN
Terminal Form THROUGH-HOLE GULL WING
Terminal Pitch 2.54 mm 1.27 mm
Terminal Position DUAL DUAL
Width 7.62 mm 3.9 mm
Base Number Matches 2 2
Additional Feature NOT AVAILABLE IN JAPAN
Peak Reflow Temperature (Cel) NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED

Compare MM74HCT00N with alternatives

Compare TC74HC132AFN with alternatives