MM74HC574WMX vs TC74HC574AFW(TP2) feature comparison

MM74HC574WMX National Semiconductor Corporation

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TC74HC574AFW(TP2) Toshiba America Electronic Components

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Part Life Cycle Code Transferred Active
Ihs Manufacturer NATIONAL SEMICONDUCTOR CORP TOSHIBA CORP
Package Description PLASTIC, SO-20 SOP,
Reach Compliance Code unknown unknown
Additional Feature BROADSIDE VERSION OF 374 BROADSIDE VERSION OF 374; ENABLE TIME @ RL=1K
Family HC/UH HC/UH
JESD-30 Code R-PDSO-G20 R-PDSO-G20
Length 12.8 mm 12.8 mm
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type BUS DRIVER BUS DRIVER
Number of Bits 8 8
Number of Functions 1 1
Number of Ports 2 2
Number of Terminals 20 20
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Output Characteristics 3-STATE 3-STATE
Output Polarity TRUE TRUE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP SOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Propagation Delay (tpd) 29 ns 38 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.65 mm 2.7 mm
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Form GULL WING GULL WING
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position DUAL DUAL
Width 7.5 mm 7.5 mm
Base Number Matches 5 1
Pbfree Code No
Rohs Code No
Part Package Code SOIC
Pin Count 20
Peak Reflow Temperature (Cel) 240
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED

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