MM74HC32MTC
vs
N74F32N,602
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
FAIRCHILD SEMICONDUCTOR CORP
NXP SEMICONDUCTORS
Part Package Code
TSSOP
DIP
Package Description
4.40 MM, MO-153, TSSOP-14
0.300 INCH, PLASTIC, DIP-14
Pin Count
14
14
Manufacturer Package Code
14 LD,TSSOP,JEDEC MO-153, 4.4MM WIDE
SOT27-1
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
HTS Code
8542.39.00.01
8542.39.00.01
Family
HC/UH
F/FAST
JESD-30 Code
R-PDSO-G14
R-PDIP-T14
JESD-609 Code
e4
e4
Length
5 mm
19.025 mm
Load Capacitance (CL)
50 pF
50 pF
Logic IC Type
OR GATE
OR GATE
Max I(ol)
0.004 A
0.02 A
Moisture Sensitivity Level
1
Number of Functions
4
4
Number of Inputs
2
2
Number of Terminals
14
14
Operating Temperature-Max
85 °C
70 °C
Operating Temperature-Min
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TSSOP
DIP
Package Equivalence Code
TSSOP14,.25
DIP14,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
IN-LINE
Packing Method
RAIL
TUBE
Peak Reflow Temperature (Cel)
260
Prop. Delay@Nom-Sup
25 ns
6.6 ns
Propagation Delay (tpd)
125 ns
6.6 ns
Qualification Status
Not Qualified
Not Qualified
Schmitt Trigger
NO
NO
Seated Height-Max
1.2 mm
4.2 mm
Supply Voltage-Max (Vsup)
6 V
5.5 V
Supply Voltage-Min (Vsup)
2 V
4.5 V
Supply Voltage-Nom (Vsup)
4.5 V
5 V
Surface Mount
YES
NO
Technology
CMOS
TTL
Temperature Grade
INDUSTRIAL
COMMERCIAL
Terminal Finish
NICKEL PALLADIUM GOLD
NICKEL PALLADIUM GOLD
Terminal Form
GULL WING
THROUGH-HOLE
Terminal Pitch
0.65 mm
2.54 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
30
Width
4.4 mm
7.62 mm
Base Number Matches
3
1
Factory Lead Time
4 Weeks
Power Supply Current-Max (ICC)
15.5 mA
Compare MM74HC32MTC with alternatives
Compare N74F32N,602 with alternatives