MM74HC251MX
vs
HD74HC251RPEL
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Contact Manufacturer
Obsolete
Ihs Manufacturer
ROCHESTER ELECTRONICS LLC
RENESAS ELECTRONICS CORP
Part Package Code
SOIC
SOIC
Package Description
0.150 INCH, MS-012, SOIC-16
SOP, SOP16,.25
Pin Count
16
16
Reach Compliance Code
unknown
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Family
HC/UH
HC/UH
JESD-30 Code
R-PDSO-G16
R-PDSO-G16
JESD-609 Code
e3
Length
9.9 mm
9.9 mm
Logic IC Type
MULTIPLEXER
MULTIPLEXER
Moisture Sensitivity Level
1
1
Number of Functions
1
1
Number of Inputs
8
8
Number of Outputs
1
1
Number of Terminals
16
16
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Output Characteristics
3-STATE
3-STATE
Output Polarity
COMPLEMENTARY
COMPLEMENTARY
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
SOP
SOP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE
SMALL OUTLINE
Propagation Delay (tpd)
256 ns
245 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.75 mm
1.75 mm
Supply Voltage-Max (Vsup)
6 V
6 V
Supply Voltage-Min (Vsup)
2 V
2 V
Supply Voltage-Nom (Vsup)
5 V
4.5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
MATTE TIN
Terminal Form
GULL WING
GULL WING
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
DUAL
DUAL
Width
3.9 mm
3.95 mm
Base Number Matches
4
1
Load Capacitance (CL)
50 pF
Max I(ol)
0.004 A
Package Equivalence Code
SOP16,.25
Packing Method
TR
Prop. Delay@Nom-Sup
49 ns
Compare MM74HC251MX with alternatives
Compare HD74HC251RPEL with alternatives