MM74HC244MTC
vs
74HC244BQ-Q100,115
feature comparison
Pbfree Code |
Yes
|
|
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Transferred
|
Transferred
|
Ihs Manufacturer |
FAIRCHILD SEMICONDUCTOR CORP
|
NXP SEMICONDUCTORS
|
Part Package Code |
TSSOP
|
QFN
|
Package Description |
4.40 MM, MO-153, TSSOP-20
|
2.50 X 4.50 MM, 0.85 MM HEIGHT, PLASTIC, MO-241, SOT764-1, DHVQFN-20
|
Pin Count |
20
|
20
|
Manufacturer Package Code |
20LD, TSSOP, JEDEC MO-153, 4.4MM WIDE
|
SOT764-1
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
EAR99
|
|
HTS Code |
8542.39.00.01
|
|
Control Type |
ENABLE LOW
|
ENABLE LOW
|
Family |
HC/UH
|
HC/UH
|
JESD-30 Code |
R-PDSO-G20
|
R-PQCC-N20
|
JESD-609 Code |
e4
|
|
Length |
6.5 mm
|
4.5 mm
|
Load Capacitance (CL) |
50 pF
|
50 pF
|
Logic IC Type |
BUS DRIVER
|
BUS DRIVER
|
Max I(ol) |
0.006 A
|
0.006 A
|
Moisture Sensitivity Level |
1
|
1
|
Number of Bits |
4
|
4
|
Number of Functions |
2
|
2
|
Number of Ports |
2
|
2
|
Number of Terminals |
20
|
20
|
Operating Temperature-Max |
85 °C
|
125 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Output Characteristics |
3-STATE
|
3-STATE
|
Output Polarity |
TRUE
|
TRUE
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
TSSOP
|
HVQCCN
|
Package Equivalence Code |
TSSOP20,.25
|
LCC20,.1X.18,20
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
Peak Reflow Temperature (Cel) |
260
|
260
|
Prop. Delay@Nom-Sup |
29 ns
|
33 ns
|
Propagation Delay (tpd) |
208 ns
|
165 ns
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
1.2 mm
|
1 mm
|
Supply Voltage-Max (Vsup) |
6 V
|
6 V
|
Supply Voltage-Min (Vsup) |
2 V
|
2 V
|
Supply Voltage-Nom (Vsup) |
4.5 V
|
5 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
INDUSTRIAL
|
AUTOMOTIVE
|
Terminal Finish |
NICKEL PALLADIUM GOLD
|
|
Terminal Form |
GULL WING
|
NO LEAD
|
Terminal Pitch |
0.65 mm
|
0.5 mm
|
Terminal Position |
DUAL
|
QUAD
|
Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
Width |
4.4 mm
|
2.5 mm
|
Base Number Matches |
3
|
2
|
Factory Lead Time |
|
4 Weeks
|
Packing Method |
|
TR
|
Screening Level |
|
AEC-Q100
|
|
|
|
Compare MM74HC244MTC with alternatives