MM74HC240WMX vs 74HC240DB feature comparison

MM74HC240WMX Texas Instruments

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74HC240DB NXP Semiconductors

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Part Life Cycle Code Transferred Transferred
Ihs Manufacturer NATIONAL SEMICONDUCTOR CORP NXP SEMICONDUCTORS
Part Package Code SOIC SSOP
Package Description SOP, 5.30 MM, PLASTIC, MO-150, SOT339-1, SSOP-20
Pin Count 20 20
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Family HC/UH HC/UH
JESD-30 Code R-PDSO-G20 R-PDSO-G20
Length 12.8 mm 7.2 mm
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type BUS DRIVER BUS DRIVER
Number of Bits 4 4
Number of Functions 2 2
Number of Ports 2 2
Number of Terminals 20 20
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Output Characteristics 3-STATE 3-STATE
Output Polarity INVERTED INVERTED
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP SSOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE, SHRINK PITCH
Propagation Delay (tpd) 25 ns 150 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.65 mm 2 mm
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL AUTOMOTIVE
Terminal Form GULL WING GULL WING
Terminal Pitch 1.27 mm 0.65 mm
Terminal Position DUAL DUAL
Width 7.5 mm 5.3 mm
Base Number Matches 1 4
Pbfree Code Yes
Rohs Code Yes
Control Type ENABLE LOW
JESD-609 Code e4
Max I(ol) 0.006 A
Moisture Sensitivity Level 1
Package Equivalence Code SSOP20,.3
Packing Method TUBE
Peak Reflow Temperature (Cel) 260
Prop. Delay@Nom-Sup 30 ns
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au)
Time@Peak Reflow Temperature-Max (s) 30

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