MM74HC175MTCX
vs
TC74HC375AFN
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Active
Obsolete
Ihs Manufacturer
ROCHESTER ELECTRONICS LLC
TOSHIBA CORP
Part Package Code
TSSOP
SOIC
Package Description
4.40 MM, MO-153, TSSOP-16
SOP, SOP16,.25
Pin Count
16
16
Reach Compliance Code
unknown
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Family
HC/UH
HC/UH
JESD-30 Code
R-PDSO-G16
R-PDSO-G16
JESD-609 Code
e4
Length
5 mm
9.9 mm
Logic IC Type
D FLIP-FLOP
D LATCH
Moisture Sensitivity Level
1
Number of Bits
4
2
Number of Functions
1
2
Number of Terminals
16
16
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Output Polarity
COMPLEMENTARY
COMPLEMENTARY
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TSSOP
SOP
Package Equivalence Code
TSSOP16,.25
SOP16,.25
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
SMALL OUTLINE
Propagation Delay (tpd)
190 ns
150 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.1 mm
1.75 mm
Supply Voltage-Max (Vsup)
6 V
6 V
Supply Voltage-Min (Vsup)
2 V
2 V
Supply Voltage-Nom (Vsup)
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
NICKEL PALLADIUM GOLD
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.65 mm
1.27 mm
Terminal Position
DUAL
DUAL
Trigger Type
POSITIVE EDGE
HIGH LEVEL
Width
4.4 mm
3.9 mm
fmax-Min
70 MHz
Base Number Matches
1
1
Additional Feature
NOT AVAILABLE IN JAPAN
Load Capacitance (CL)
50 pF
Max I(ol)
0.004 A
Peak Reflow Temperature (Cel)
240
Prop. Delay@Nom-Sup
30 ns
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Compare MM74HC175MTCX with alternatives
Compare TC74HC375AFN with alternatives