MM74HC175MTCX vs TC74AC112F(TP2) feature comparison

MM74HC175MTCX Rochester Electronics LLC

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TC74AC112F(TP2) Toshiba America Electronic Components

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Pbfree Code Yes No
Rohs Code Yes No
Part Life Cycle Code Active End Of Life
Ihs Manufacturer ROCHESTER ELECTRONICS LLC TOSHIBA CORP
Part Package Code TSSOP SOIC
Package Description 4.40 MM, MO-153, TSSOP-16 SOP,
Pin Count 16 16
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Family HC/UH AC
JESD-30 Code R-PDSO-G16 R-PDSO-G16
JESD-609 Code e4 e0
Length 5 mm 10.3 mm
Logic IC Type D FLIP-FLOP J-K FLIP-FLOP
Moisture Sensitivity Level 1
Number of Bits 4 2
Number of Functions 1 2
Number of Terminals 16 16
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Output Polarity COMPLEMENTARY COMPLEMENTARY
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSSOP SOP
Package Equivalence Code TSSOP16,.25
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE
Propagation Delay (tpd) 190 ns 10.8 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.1 mm 1.9 mm
Supply Voltage-Max (Vsup) 6 V 5.5 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish NICKEL PALLADIUM GOLD TIN LEAD
Terminal Form GULL WING GULL WING
Terminal Pitch 0.65 mm 1.27 mm
Terminal Position DUAL DUAL
Trigger Type POSITIVE EDGE NEGATIVE EDGE
Width 4.4 mm 5.3 mm
fmax-Min 70 MHz 80 MHz
Base Number Matches 1 1
Load Capacitance (CL) 50 pF
Max I(ol) 0.024 A
Power Supply Current-Max (ICC) 0.08 mA

Compare MM74HC175MTCX with alternatives

Compare TC74AC112F(TP2) with alternatives