MM74HC157SJX
vs
TC74HC157AF(TP1)
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Active
Ihs Manufacturer
ROCHESTER ELECTRONICS LLC
TOSHIBA CORP
Part Package Code
SOIC
SOIC
Package Description
5.30 MM, EIAJ TYPE2, SOP-16
SOP,
Pin Count
16
16
Reach Compliance Code
unknown
unknown
HTS Code
8542.39.00.01
Family
HC/UH
HC/UH
JESD-30 Code
R-PDSO-G16
R-PDSO-G16
JESD-609 Code
e3
e0
Length
10.1 mm
10.3 mm
Logic IC Type
MULTIPLEXER
MULTIPLEXER
Moisture Sensitivity Level
1
Number of Functions
4
4
Number of Inputs
2
2
Number of Outputs
1
1
Number of Terminals
16
16
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Output Polarity
TRUE
TRUE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
SOP
SOP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE
SMALL OUTLINE
Propagation Delay (tpd)
158 ns
31 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
2.1 mm
1.9 mm
Supply Voltage-Max (Vsup)
6 V
6 V
Supply Voltage-Min (Vsup)
2 V
2 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
MATTE TIN
TIN LEAD
Terminal Form
GULL WING
GULL WING
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
DUAL
DUAL
Width
5.3 mm
5.3 mm
Base Number Matches
2
1
Load Capacitance (CL)
50 pF
Peak Reflow Temperature (Cel)
240
Supply Voltage-Nom (Vsup)
5 V
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Compare MM74HC157SJX with alternatives
Compare TC74HC157AF(TP1) with alternatives