MM74HC154MTC
vs
TC74HC138AF-TP1
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Active
Ihs Manufacturer
FAIRCHILD SEMICONDUCTOR CORP
TOSHIBA CORP
Part Package Code
TSSOP
SOIC
Package Description
4.40 MM, MO-153, TSSOP-24
SOP,
Pin Count
24
16
Reach Compliance Code
unknown
unknown
ECCN Code
EAR99
EAR99
HTS Code
8542.39.00.01
8542.39.00.01
Family
HC/UH
HC/UH
Input Conditioning
STANDARD
STANDARD
JESD-30 Code
R-PDSO-G24
R-PDSO-G16
JESD-609 Code
e4
e0
Length
7.8 mm
10.3 mm
Load Capacitance (CL)
50 pF
50 pF
Logic IC Type
OTHER DECODER/DRIVER
3-LINE TO 8-LINE DECODER
Max I(ol)
0.004 A
Moisture Sensitivity Level
1
Number of Functions
1
1
Number of Terminals
24
16
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Output Polarity
INVERTED
INVERTED
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TSSOP
SOP
Package Equivalence Code
TSSOP24,.25
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
SMALL OUTLINE
Peak Reflow Temperature (Cel)
260
NOT SPECIFIED
Prop. Delay@Nom-Sup
42 ns
Propagation Delay (tpd)
190 ns
190 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.1 mm
1.9 mm
Supply Voltage-Max (Vsup)
6 V
6 V
Supply Voltage-Min (Vsup)
2 V
2 V
Supply Voltage-Nom (Vsup)
4.5 V
4.5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
NICKEL PALLADIUM GOLD
Tin/Lead (Sn/Pb)
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.65 mm
1.27 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
40
NOT SPECIFIED
Width
4.4 mm
5.3 mm
Base Number Matches
2
1
Pbfree Code
Additional Feature
3 ENABLE INPUTS
Compare MM74HC154MTC with alternatives
Compare TC74HC138AF-TP1 with alternatives