MM74HC123N vs TC74HC123AP feature comparison

MM74HC123N Texas Instruments

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TC74HC123AP Toshiba America Electronic Components

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Rohs Code No Yes
Part Life Cycle Code Obsolete Active
Ihs Manufacturer NATIONAL SEMICONDUCTOR CORP TOSHIBA CORP
Package Description DIP, DIP16,.3 DIP, DIP16,.3
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Additional Feature RETRIGGERABLE
Family HC/UH HC/UH
JESD-30 Code R-PDIP-T16 R-PDIP-T16
JESD-609 Code e0
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type MONOSTABLE MULTIVIBRATOR MONOSTABLE MULTIVIBRATOR
Number of Data/Clock Inputs 2 2
Number of Functions 2 2
Number of Terminals 16 16
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Output Polarity COMPLEMENTARY COMPLEMENTARY
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP DIP
Package Equivalence Code DIP16,.3 DIP16,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Propagation Delay (tpd) 51 ns 265 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 3.957 mm 4.45 mm
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish Tin/Lead (Sn/Pb)
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Width 7.62 mm 7.62 mm
Base Number Matches 1 1
Pbfree Code Yes
Part Package Code DIP
Pin Count 16
Samacsys Manufacturer Toshiba
Length 19.25 mm
Peak Reflow Temperature (Cel) NOT SPECIFIED
Power Supply Current-Max (ICC) 1.3 mA
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED

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