MM74HC02M vs 74HC02D feature comparison

MM74HC02M onsemi

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74HC02D NXP Semiconductors

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Pbfree Code Yes Yes
Part Life Cycle Code Active Transferred
Ihs Manufacturer ONSEMI NXP SEMICONDUCTORS
Part Package Code SOIC-14 SOIC
Package Description SOIC-14 3.90 MM, PLASTIC, MS-012, SOT108-1, SOP-14
Manufacturer Package Code 751A-03
Reach Compliance Code compliant unknown
HTS Code 8542.39.00.01 8542.39.00.01
Factory Lead Time 8 Weeks, 4 Days
Samacsys Manufacturer onsemi NXP
Family HC/UH HC/UH
JESD-30 Code R-PDSO-G14 R-PDSO-G14
JESD-609 Code e4 e4
Length 8.6235 mm 8.65 mm
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type NOR GATE NOR GATE
Max I(ol) 0.004 A 0.004 A
Moisture Sensitivity Level 1 1
Number of Functions 4 4
Number of Inputs 2 2
Number of Terminals 14 14
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP SOP
Package Equivalence Code SOP14,.25 SOP14,.25
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Packing Method RAIL BULK
Peak Reflow Temperature (Cel) 260 260
Prop. Delay@Nom-Sup 27 ns 27 ns
Propagation Delay (tpd) 113 ns 27 ns
Qualification Status Not Qualified Not Qualified
Schmitt Trigger NO NO
Seated Height-Max 1.753 mm 1.75 mm
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 4.5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE AUTOMOTIVE
Terminal Finish NICKEL PALLADIUM GOLD Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form GULL WING GULL WING
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30 30
Width 3.9 mm 3.9 mm
Base Number Matches 5 4
Rohs Code Yes
Pin Count 14
ECCN Code EAR99

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