MM74C175N vs TC40175BP feature comparison

MM74C175N National Semiconductor Corporation

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TC40175BP Toshiba America Electronic Components

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Rohs Code No No
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer NATIONAL SEMICONDUCTOR CORP TOSHIBA CORP
Package Description PLASTIC, DIP-16 DIP,
Reach Compliance Code compliant unknown
Family CMOS 4000/14000/40000
JESD-30 Code R-PDIP-T16 R-PDIP-T16
JESD-609 Code e0 e0
Length 19.305 mm 19.25 mm
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type D FLIP-FLOP D FLIP-FLOP
Max Frequency@Nom-Sup 2000000 Hz
Max I(ol) 0.00035999999999999997 A
Number of Bits 4 4
Number of Functions 1 1
Number of Terminals 16 16
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Output Polarity COMPLEMENTARY COMPLEMENTARY
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP DIP
Package Equivalence Code DIP16,.3 DIP16,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Propagation Delay (tpd) 300 ns 340 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 5.08 mm 4.45 mm
Supply Voltage-Max (Vsup) 15 V 18 V
Supply Voltage-Min (Vsup) 3 V 3 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish Tin/Lead (Sn/Pb) TIN LEAD
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Trigger Type POSITIVE EDGE POSITIVE EDGE
Width 7.62 mm 7.62 mm
fmax-Min 5 MHz 3.5 MHz
Base Number Matches 4 1
Part Package Code DIP
Pin Count 16

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