MM74C107N
vs
MC14175BFELG
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
NATIONAL SEMICONDUCTOR CORP
ON SEMICONDUCTOR
Package Description
PLASTIC, DIP-14
SOP, SOP16,.3
Reach Compliance Code
unknown
compliant
HTS Code
8542.39.00.01
8542.39.00.01
Family
CMOS
4000/14000/40000
JESD-30 Code
R-PDIP-T14
R-PDSO-G16
JESD-609 Code
e0
e4
Length
19.215 mm
10.2 mm
Load Capacitance (CL)
50 pF
50 pF
Logic IC Type
J-K FLIP-FLOP
D FLIP-FLOP
Max Frequency@Nom-Sup
2500000 Hz
2000000 Hz
Number of Bits
2
4
Number of Functions
2
1
Number of Terminals
14
16
Operating Temperature-Max
85 °C
125 °C
Operating Temperature-Min
-40 °C
-55 °C
Output Polarity
COMPLEMENTARY
COMPLEMENTARY
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
DIP
SOP
Package Equivalence Code
DIP14,.3
SOP16,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
SMALL OUTLINE
Propagation Delay (tpd)
300 ns
400 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
5.08 mm
2.05 mm
Supply Voltage-Max (Vsup)
15 V
18 V
Supply Voltage-Min (Vsup)
3 V
3 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
MILITARY
Terminal Finish
TIN LEAD
NICKEL PALLADIUM GOLD
Terminal Form
THROUGH-HOLE
GULL WING
Terminal Pitch
2.54 mm
1.27 mm
Terminal Position
DUAL
DUAL
Trigger Type
NEGATIVE EDGE
POSITIVE EDGE
Width
7.62 mm
5.275 mm
fmax-Min
2.5 MHz
6.5 MHz
Base Number Matches
3
1
Pbfree Code
Part Package Code
SOIC
Pin Count
16
Moisture Sensitivity Level
3
Packing Method
TR
Peak Reflow Temperature (Cel)
260
Time@Peak Reflow Temperature-Max (s)
30
Compare MM74C107N with alternatives
Compare MC14175BFELG with alternatives