Findchips: Compare MM74C04CW vs 74LVC132ABQ,115

MM74C04CW vs 74LVC132ABQ,115 feature comparison

Buy Now Datasheet

Buy Now Datasheet

Part Life Cycle Code	Obsolete	Transferred
Ihs Manufacturer	FAIRCHILD SEMICONDUCTOR CORP	NXP SEMICONDUCTORS
Part Package Code	WAFER	QFN
Package Description	DIE,	HVQCCN, LCC14,.1X.12,20
Reach Compliance Code	unknown	compliant
HTS Code	8542.39.00.01	8542.39.00.01
Family	CMOS	LVC/LCX/Z
JESD-30 Code	X-XUUC-N14	R-PQCC-N14
Logic IC Type	INVERTER	NAND GATE
Number of Functions	6	4
Number of Inputs	1	2
Number of Terminals	14	14
Package Body Material	UNSPECIFIED	PLASTIC/EPOXY
Package Code	DIE	HVQCCN
Package Equivalence Code	DIE OR CHIP	LCC14,.1X.12,20
Package Shape	UNSPECIFIED	RECTANGULAR
Package Style	UNCASED CHIP	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
Propagation Delay (tpd)	90 ns	16 ns
Qualification Status	Not Qualified	Not Qualified
Supply Voltage-Max (Vsup)	15 V	3.6 V
Supply Voltage-Min (Vsup)	3 V	1.2 V
Supply Voltage-Nom (Vsup)	5 V	3.3 V
Surface Mount	YES	YES
Technology	CMOS	CMOS
Terminal Form	NO LEAD	NO LEAD
Terminal Position	UPPER	QUAD
Base Number Matches	1	2
Rohs Code		Yes
Pin Count		14
Manufacturer Package Code		SOT762-1
JESD-609 Code		e4
Length		3 mm
Max I(ol)		0.024 A
Moisture Sensitivity Level		1
Operating Temperature-Max		125 °C
Operating Temperature-Min		-40 °C
Packing Method		TR
Peak Reflow Temperature (Cel)		260
Prop. Delay@Nom-Sup		8 ns
Schmitt Trigger		YES
Seated Height-Max		1 mm
Temperature Grade		AUTOMOTIVE
Terminal Finish		Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Pitch		0.5 mm
Time@Peak Reflow Temperature-Max (s)		30
Width		2.5 mm
	Logic » Gates	Logic » Gates